The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Oct. 24, 2017
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Koichi Ida, Nagaokakyo, JP;

Shun Ozaki, Nagaokakyo, JP;

Hou Muramoto, Nagaokakyo, JP;

Isao Ida, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/04 (2006.01); H01F 27/32 (2006.01); H01F 27/255 (2006.01); H01F 41/06 (2016.01); H01F 41/12 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01F 27/324 (2013.01); H01F 27/255 (2013.01); H01F 41/06 (2013.01); H01F 41/125 (2013.01); H01F 27/2823 (2013.01);
Abstract

An electronic component includes a coil, or a coiled conductor, and a molded body including a sealant containing resin and magnetic powder, and encapsulating the coil. The coil is coated with a cured product of a thermosetting composition, and the coated body is embedded in the molded body. A method of manufacturing the electronic component includes forming a coil by winding a conductor, applying a thermosetting composition on the coil, heat treating the coil on which the composition is applied to obtain a coated body, embedding the coated body into a sealant containing resin and magnetic powder, and applying pressure to the sealant to form a molded body.


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