The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Jan. 06, 2016
Silver-coated resin particles, method for manufacturing same, and electroconductive paste using same
Applicant:
Mitsubishi Materials Electronic Chemicals Co., Ltd., Akita, JP;
Inventors:
Kensuke Kageyama, Akita, JP;
Hirokazu Tsukada, Akita, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 5/14 (2006.01); H01B 1/22 (2006.01); H01B 13/00 (2006.01); C23C 18/42 (2006.01);
U.S. Cl.
CPC ...
H01B 5/14 (2013.01); C23C 18/42 (2013.01); H01B 1/22 (2013.01); H01B 13/0036 (2013.01);
Abstract
A silver-coated resin particle including a heat-resistant resin core particle and a silver coating layer formed on the surface of the resin core particle. The average grain diameter of the resin core particle is 0.1 to 10 μm, the amount of silver contained in the silver coating layer is 60 to 90 parts by mass, relative to 100 parts by mass of the silver-coated resin particle, and the exothermic peak temperature of the silver-coated resin particle by differential thermal analysis is 265° C. or higher.