The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Mar. 04, 2019
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Takayasu Otagaki, Ota, JP;
Kensuke Goto, Ashikaga, JP;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 3/0487 (2013.01); G06F 3/041 (2006.01); H03K 17/96 (2006.01); H03K 17/955 (2006.01); H03K 17/975 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G06F 3/0414 (2013.01); G06F 3/0416 (2013.01); H03K 17/955 (2013.01); H03K 17/962 (2013.01); H03K 17/975 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04105 (2013.01); H03K 2217/9651 (2013.01);
Abstract
Various embodiments of the present technology may provide methods and apparatus for a capacitive pressure sensor configured to detect firm pressure to a sensing surface. The capacitive pressure sensor may include a first substrate and a second substrate, wherein at least one of the first and second substrate is configured to deform when firm pressure is applied. The deformation of the sensor may either create a gap between the substrates or eliminate a gap between the substrates. The deformation may be interpreted as firm pressure to the sensing surface.