The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Feb. 26, 2018
Applicant:

Sage Electrochromics, Inc., Faribault, MN (US);

Inventors:

Sebastian Marius Sarrach, Lakeville, MN (US);

Florent Martin, Minneapolis, MN (US);

Erik Jon Bjornard, Lakeville, MN (US);

Assignee:

SAGE ELECTROCHROMICS, INC., Faribault, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/153 (2006.01); G02F 1/155 (2006.01); G02F 1/1523 (2019.01); C23C 14/08 (2006.01); G02F 1/15 (2019.01); G02F 1/1524 (2019.01);
U.S. Cl.
CPC ...
G02F 1/155 (2013.01); C23C 14/086 (2013.01); G02F 1/153 (2013.01); G02F 1/1523 (2013.01); G02F 1/1533 (2013.01); G02F 1/1508 (2013.01); G02F 1/1524 (2019.01); G02F 1/15245 (2019.01); G02F 2001/1555 (2013.01);
Abstract

A stack of layers can be formed adjacent to a substrate before any layer within the stack is patterned. In an embodiment, combinations of substrates and stacks can be made and stored for an extended period, such as more than a week or a month, or shipped to a remote location before further manufacturing occurs. By delaying irreversible patterning until the closer to the date final product will be shipped to a customer, the likelihood of having too much inventory of a particular size or having to scrap windows for a custom order that was cancelled after manufacturing started can be substantially reduced. Further, particles between layers of the stack can be avoided. The process flows described are flexible, and many of the patterning operations in forming holes, openings, or the high resistance region can be performed in many different orders.


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