The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Jul. 03, 2015
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Keisuke Takayama, Tokyo, JP;

Hiroyuki Tachibana, Tokyo, JP;

Toru Koide, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 31/02 (2006.01); F04B 39/00 (2006.01); F04B 39/06 (2006.01); F25B 30/02 (2006.01);
U.S. Cl.
CPC ...
F25B 31/026 (2013.01); F04B 39/0061 (2013.01); F04B 39/06 (2013.01); F25B 30/02 (2013.01); F25B 2500/12 (2013.01); F25B 2500/13 (2013.01);
Abstract

A heat pump device includes a compressor, a motor, a shell, a muffler, a heat exchanger, a housing, a blower, a first insulating material, and a second insulating material. The compressor compresses refrigerant. The motor drives the compressor. The shell houses the motor and the compressor. The compressor is connected to the muffler, which is further connected to heat exchanger. The housing has first and second spaces. The shell, the heat exchanger, and the muffler are disposed in the first space. The blower is disposed in the second space. The muffler is entirely located within a space between the shell and the first heat exchanger. The first insulating material at least partially cover the discharge muffler and the first heat exchanger. The second insulating material at least partially cover the shell. The first insulating material has a higher thermal resistance than the second insulating material.


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