The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Apr. 17, 2017
Applicant:

Government of the United States of America, As Represented BY the Secretary of Commerce, Gaithersburg, MD (US);

Inventors:

Daniel Josell, N. Potomac, MD (US);

Thomas P. Moffat, Gaithersburg, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 21/12 (2006.01); C25D 7/12 (2006.01); C25D 3/12 (2006.01); C25D 3/48 (2006.01); C25D 5/02 (2006.01); C25D 5/18 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
C25D 21/12 (2013.01); C25D 3/12 (2013.01); C25D 3/48 (2013.01); C25D 5/02 (2013.01); C25D 5/18 (2013.01); C25D 7/123 (2013.01); H01L 21/2885 (2013.01);
Abstract

Forming a transition zone terminated superconformal filling in a recess includes: providing an electrodeposition composition including: a metal electrolyte including a plurality of metal ions, solvent, and suppressor; providing the article including: a field surface and the recess that includes a distal position and a proximate position; exposing the recess to the electrodeposition composition; potentiodynamically controlling an electric potential of the recess with a potential wave form; bifurcating the recess into an active metal deposition region and a passive region; forming a transition zone; decreasing the electric potential of the recess by the potential wave form; progressively moving the transition zone closer to the field surface and away from the distal position; and reducing the metal ions and depositing the metal in the active metal deposition region and not in the passive region to form the transition zone terminated superconformal filling in the recess of the substrate.


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