The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Mar. 06, 2018
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventors:
Aniruddha Joi, San Jose, CA (US);
Yezdi Dordi, Palo Alto, CA (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 5/10 (2006.01); C25D 5/18 (2006.01); C25D 5/48 (2006.01); C23C 18/16 (2006.01); C25D 21/12 (2006.01); C23C 18/54 (2006.01); C25D 9/08 (2006.01);
U.S. Cl.
CPC ...
C25D 5/10 (2013.01); C23C 18/1651 (2013.01); C23C 18/54 (2013.01); C25D 5/18 (2013.01); C25D 5/48 (2013.01); C25D 9/08 (2013.01); C25D 21/12 (2013.01);
Abstract
Layer-by-layer thickness control of an electroplated film can be achieved by using a cyclic deposition process. The cyclic process involves forming a layer (or partial layer) of hydrogen on a surface of the substrate, then displacing the layer of hydrogen with a layer of metal. These steps are repeated a number of times to deposit the metal film to a desired thickness. Each step in the cycle is self-limiting, thereby enabling atomic level thickness control.