The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Sep. 07, 2017
Applicants:
Boe Technology Group Co., Ltd., Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;
Inventors:
Huan Ni, Beijing, CN;
Fengzhen Lv, Beijing, CN;
Assignees:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., Hefei, Anhui, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); H01L 23/00 (2006.01); C09J 123/06 (2006.01); C09J 129/04 (2006.01); C09J 11/00 (2006.01); C09D 129/04 (2006.01); C08K 9/02 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09D 129/04 (2013.01); C09J 11/00 (2013.01); C09J 123/06 (2013.01); C09J 129/04 (2013.01); H01L 24/50 (2013.01); C08K 9/02 (2013.01); C08K 2201/001 (2013.01); H01L 2224/29 (2013.01);
Abstract
The present disclosure provides a conductive particle, its manufacturing method and the anisotropic conductive adhesive. The conductive particle comprises a rigid inner core, a resin layer covering an outer surface of the rigid inner core, and a conductive layer covering an outer surface of the resin layer.