The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2019
Filed:
Feb. 25, 2016
Teijin Limited, Osaka-Shi, Osaka, JP;
Masatomo Teshima, Osaka, JP;
Teijin Limited, Osaka-Shi, Osaka, JP;
Abstract
A resin structure having an impact absorbing property includes a resin member including a resin material and having an uneven thickness structure. The resin member includes a thick-walled portion having an average thickness of a first value in an impact absorbing direction and two thin-walled portions having an average thickness of less than the first value in the impact absorbing direction. The thick-walled portion is disposed between the two thin-walled portions. The Expressions (I) and (II) are satisfied.1<1/2<1.545×()  (I)>0  (II) In Expressions (I) and (II), t1 represents an average thickness (mm) of the thick-walled portion. t2 represents an average thickness (mm) of the thin-walled portions. L represents an inter-connection-point distance (mm) between connection points formed on the two thin-walled portions, respectively, and connected to other structures. d represents a maximum height (mm) in the impact absorbing direction in a range between the connection points of the resin member.