The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Mar. 28, 2012
Applicants:

Benjamin Warren Penner, Ann Arbor, MI (US);

Kerry Scott Zellner, Jr., Saline, MI (US);

Inventors:

Benjamin Warren Penner, Ann Arbor, MI (US);

Kerry Scott Zellner, Jr., Saline, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/00 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0025 (2013.01); B29C 2045/0043 (2013.01); B29L 2031/3005 (2013.01); Y10T 428/24479 (2015.01);
Abstract

A molded component having a thickness reduction feature is provided. The molded component can include an injection molded polymer substrate having a front panel, a side panel, and a corner between and adjoining the front panel and the side panel. The substrate can also have a groove extending along the corner between the front panel and the side panel, the groove having a front panel edge and a side panel edge. The front panel edge and/or side panel edge have a dentil profile edge, the dentil profile edge reducing an effective thickness of the corner and thus providing increased or controlled cooling of the substrate.


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