The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Jul. 16, 2018
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Boe Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;

Inventors:

Xuemei Zhao, Beijing, CN;

Hu Li, Beijing, CN;

Jian He, Beijing, CN;

Zhi Zhang, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01L 23/58 (2006.01); G01R 27/26 (2006.01); G09G 5/00 (2006.01); G09G 3/00 (2006.01); H05K 1/18 (2006.01); G01R 31/28 (2006.01); G02F 1/1333 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); G01R 31/2825 (2013.01); G02F 1/133305 (2013.01); H05K 1/0268 (2013.01); H05K 1/118 (2013.01); H05K 3/361 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/09918 (2013.01);
Abstract

The disclosure discloses a display panel, a detection method thereof, a flexible printed circuit, and a display device. The flexible printed circuit includes a second bonding area, a plurality of contact pins and at least one test pin group are arranged in the second bonding area; the contact pins are configured to be bonded respectively with corresponding contact pads in the first bonding area; the test pin group is configured to be bonded with a corresponding test pad group in the first bonding area; the test pin group includes test pins; and the test pin group is configured so that after bonding, bonding states of the contact pins with the contact pads are determined by detecting conducting or non-conducting state between the test pins and the corresponding test pads.


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