The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Oct. 14, 2016
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Atsushi Tsukada, Kanagawa, JP;

Eiichirou Kishida, Kumamoto, JP;

Daisuke Nakatsuru, Kumamoto, JP;

Hiroyuki Kaji, Kumamoto, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/369 (2011.01); H01L 21/52 (2006.01); H01L 31/02 (2006.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/369 (2013.01); H01L 21/52 (2013.01); H01L 23/00 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 31/02 (2013.01); H04N 5/2257 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/16195 (2013.01); H04N 5/2253 (2013.01);
Abstract

[Object] To provide a solid-state imaging device, with which degradation of properties of a solid-state image sensor under the influence of magnetic force lines generated from wiring arranged in the package is prevented, and a solid-state imaging apparatus including the same. [Solving Means] A solid-state imaging device according to the present technology includes a package, a seal glass, a solid-state image sensor, and a shield. The package includes wiring inside and a recess. The seal glass is joined to the package and closes the recess. The solid-state image sensor is housed in a space formed by the recess and the seal glass. The shield is housed in the space and arranged on the package. The shield prevents an arrival of magnetic force lines generated from the wiring at the solid-state image sensor.


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