The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Mar. 30, 2018
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Hidenori Obiya, Kyoto, JP;

Shinya Hitomi, Kyoto, JP;

Reiji Nakajima, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/14 (2006.01); H03F 3/191 (2006.01); H03F 3/24 (2006.01); H04B 1/00 (2006.01); H04B 1/04 (2006.01); H04B 1/40 (2015.01); H03G 3/30 (2006.01); H03G 5/28 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01); H03F 3/72 (2006.01); H04B 1/18 (2006.01); H04B 1/48 (2006.01);
U.S. Cl.
CPC ...
H03F 3/245 (2013.01); H03F 1/56 (2013.01); H03F 3/195 (2013.01); H03F 3/72 (2013.01); H03G 3/3042 (2013.01); H03G 5/28 (2013.01); H04B 1/00 (2013.01); H04B 1/0057 (2013.01); H04B 1/04 (2013.01); H04B 1/0458 (2013.01); H04B 1/18 (2013.01); H04B 1/40 (2013.01); H04B 1/48 (2013.01); H03F 2200/111 (2013.01); H03F 2200/451 (2013.01); H03F 2203/7209 (2013.01); H04B 2001/0408 (2013.01);
Abstract

A PA module includes a previous stage amplification element to amplify a high-frequency signal, a posterior stage amplification element to amplify the high-frequency signal amplified by the previous stage amplification element, and a variable filter circuit arranged between the previous stage amplification element and the posterior stage amplification element and to vary a pass band and an attenuation band in accordance with a frequency band of the high-frequency signal, in which the variable filter circuit includes a filter portion and switches, the previous stage amplification element, the switches, and the posterior stage amplification element are arranged on a mounting surface of a substrate, the filter portion is stacked and arranged so as to overlap with at least one of the previous stage amplification element, the switches, and the posterior stage amplification element when the substrate is viewed in a plan view.


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