The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Jul. 08, 2019
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Chu Xu, Nagaokakyo, JP;

Takahiro Baba, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/52 (2011.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); H01R 12/62 (2011.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01R 12/52 (2013.01); H01R 12/62 (2013.01); H05K 1/0271 (2013.01); H05K 1/0298 (2013.01); H05K 1/0313 (2013.01); H05K 1/113 (2013.01); H05K 3/363 (2013.01); H05K 3/368 (2013.01); H05K 1/144 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/041 (2013.01); H05K 2201/052 (2013.01); H05K 2201/056 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/09945 (2013.01); H05K 2201/1031 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.


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