The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Aug. 24, 2018
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventor:

Masahito Ozaki, Shizuoka, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/24 (2006.01); H01R 4/58 (2006.01); H01R 4/34 (2006.01); H01B 7/00 (2006.01); H01R 43/16 (2006.01); H01R 11/12 (2006.01);
U.S. Cl.
CPC ...
H01R 4/58 (2013.01); H01B 7/0009 (2013.01); H01R 4/34 (2013.01); H01R 43/16 (2013.01); H01R 11/12 (2013.01);
Abstract

A conductor connection structure includes a first plate-like routing member, a second plate-like routing member and a connection mechanism. The first plate-like routing member includes a first flat conductor and a first insulative coating which covers the first flat conductor. A first conductor piece is continuously extended from the first flat conductor at one longer edge of the first plate-like routing member and is exposed from the first insulative coating. The second plate-like routing member includes a second flat conductor and a second insulative coating which covers the second flat conductor. A second conductor piece is continuously extended from the second flat conductor at one longer edge of the second plate-like routing member and is exposed from the second insulative coating. The connection mechanism connects the first conductor piece and the second conductor piece to each other electrically.


Find Patent Forward Citations

Ozaki, Masahito. (2019). Conductor connection structure of plate-like routing members (U.S. Patent No. 10505291). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10505291

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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