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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10505286 B1

PDFFull Text
Date of Patent:
Dec. 10, 2019

Filed:

Mar. 24, 2017

Sensor element and manufacturing method of sensor element

Applicant:

Shibaura Electronics Co., Ltd., Saitama-shi, Saitama, JP;

Inventors:

Tatsuyuki Suzuki, Saitama, JP;

Naoki Tsuneta, Aomori, JP;

Ryohei Takada, Aomori, JP;

Assignee:

SHIBAURA ELECTRONICS CO., LTD., Saitama-Shi, Saitama, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Andargie M Aychillhum

Assistant Examiner:

Michael F McAllister

Int. Cl.
CPC ...
B23K 11/24 (2006.01); G01K 7/22 (2006.01); H01R 43/28 (2006.01); H01R 4/02 (2006.01); B23K 11/00 (2006.01); B23K 11/16 (2006.01); B23K 11/34 (2006.01); H01R 43/02 (2006.01); B23K 101/32 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
H01R 4/029 (2013.01); B23K 11/0026 (2013.01); B23K 11/166 (2013.01); B23K 11/34 (2013.01); G01K 7/22 (2013.01); H01R 4/022 (2013.01); H01R 4/028 (2013.01); H01R 43/0214 (2013.01); H01R 43/28 (2013.01); B23K 2101/32 (2018.08); B23K 2101/38 (2018.08);
Abstract

A sensor element includes: an element body including, for example, a thermistor; paired lead wires drawn out from the element body; and stranded wires that are each obtained by twisting a plurality of core wires and are joined to the respective paired lead wires in a welding region. The welding region includes a main joining region provided in a predetermined region in an axis direction, and sub joining regions adjacent to the main joining region, and joining strength of each of the lead wires and the corresponding stranded wire is higher in the main joining region than in the sub-joining region.

Find Patent Forward Citations

Suzuki, Tatsuyuki. (2019). Sensor element and manufacturing method of sensor element (U.S. Patent No. 10505286). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10505286

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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