The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Dec. 18, 2014
Applicant:

Microcontinuum, Inc., Cambridge, MA (US);

Inventor:

W. Dennis Slafer, Arlington, MA (US);

Assignee:

MicroContinuum, Inc., Cambridge, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/00 (2006.01); C25D 7/00 (2006.01); C25D 5/00 (2006.01); C23C 18/00 (2006.01); H01Q 1/36 (2006.01); C25D 5/02 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/00 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/364 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); C23C 18/1605 (2013.01); C23C 18/165 (2013.01); C25D 5/022 (2013.01); C25D 7/00 (2013.01); G03F 7/0002 (2013.01); Y10T 156/1039 (2015.01);
Abstract

Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal. In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.


Find Patent Forward Citations

Loading…