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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10505089 B1

PDFFull Text
Date of Patent:
Dec. 10, 2019

Filed:

Apr. 26, 2019

Method of manufacturing light emitting device

Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Mototaka Inobe, Anan, JP;

Motokazu Yamada, Tokushima, JP;

Kazuhiro Kamada, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:

Mori & Ward, LLP

Primary Examiner:

Laura M Menz

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/60 (2010.01); H01L 33/32 (2010.01); H01L 33/20 (2010.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/20 (2013.01); H01L 33/32 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of manufacturing a light emitting device includes providing a substrate and establishing metallization on an upper surface of the substrate. A light emitting element is mounted on top of the metallization, and the metallization and light emitting element are electrically connected. Light reflective resin is provided at a position surrounding the light emitting element to reflect light from the light emitting element. The surfaces of metallization, a surface of the light emitting element, a conducting wire, and a top surface of the light reflective resin are covered continuously, with insulating material. An inside surrounded by the light reflective resin is filled with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element.

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