The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Feb. 28, 2016
Applicant:

Xiamen Sanan Optoelectronics Technology Co., Ltd., Xiamen, CN;

Inventors:

Chih-Wei Chao, Xiamen, CN;

Yen-Chih Chiang, Xiamen, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/34 (2010.01); H01L 33/48 (2010.01); H01L 33/38 (2010.01); H01L 33/50 (2010.01); H01L 33/46 (2010.01); H01L 33/20 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/34 (2013.01); H01L 33/385 (2013.01); H01L 33/46 (2013.01); H01L 33/483 (2013.01); H01L 33/50 (2013.01); H01L 33/20 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01);
Abstract

A packaging structure of a vertical LED chip includes at least a support system, a glue cup that connects to periphery of the support system, a LED chip with light absorption substrate over the support system and packaging glue distributed in periphery of the LED chip. The light absorption substrate has a side forming a bubble structure at an interface with the packaging glue. A reflecting layer is formed from material refractivity difference of the packaging glue, the bubble structure and the light absorption substrate for eliminating or reducing light absorption by the substrate.


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