The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Dec. 14, 2017
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Shun Kitahama, Tokushima, JP;

Yoshiki Inoue, Anan, JP;

Kazuhiro Nagamine, Komatsushima, JP;

Junya Narita, Yoshinogawa, JP;

Assignee:

NICHIA CORPORATION, Anan-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/44 (2010.01); H01L 33/38 (2010.01); H01L 33/08 (2010.01); H01L 33/32 (2010.01); H01L 21/301 (2006.01); H01L 21/324 (2006.01); H01L 33/14 (2010.01); H01L 21/268 (2006.01); H01L 33/22 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 33/007 (2013.01); H01L 33/0075 (2013.01); H01L 33/145 (2013.01); H01L 33/32 (2013.01); H01L 33/382 (2013.01); H01L 33/44 (2013.01); H01L 21/268 (2013.01); H01L 33/22 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A method for manufacturing a plurality of light emitting elements includes: providing a semiconductor wafer comprising: a substrate, an n-side nitride semiconductor layer containing an n-type impurity and located on the substrate, and a p-side nitride semiconductor layer containing a p-type impurity and located on the n-side nitride semiconductor layer; forming a protective layer on an upper face of the p-side nitride semiconductor layer in regions that include borders of areas to become the plurality of light emitting elements; reducing a resistance of the p-side nitride semiconductor in areas where no protective layer has been formed by annealing the semiconductor wafer; irradiating a laser beam on the substrate so as to form modified regions in the substrate; and obtaining a plurality of light emitting elements by dividing the semiconductor wafer in which the modified regions have been formed in the substrate.


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