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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10504868 B1

PDFFull Text
Date of Patent:
Dec. 10, 2019

Filed:

May. 31, 2018

Solder joining

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Hirohiko Watanabe, Hachioji, JP;

Shunsuke Saito, Hachioji, JP;

Yoshihiro Kodaira, Shenzhen, CN;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:

Erin B Saad

Int. Cl.
CPC ...
B23K 1/00 (2006.01); H01L 21/00 (2006.01); H01L 23/00 (2006.01); B23K 35/26 (2006.01); C22C 13/02 (2006.01); H01L 21/52 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01); H01L 23/373 (2006.01); H05K 3/34 (2006.01); B23K 103/12 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 35/0238 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); C22C 13/02 (2013.01); H01L 21/52 (2013.01); H01L 23/3735 (2013.01); H01L 24/73 (2013.01); B23K 2101/40 (2018.08); B23K 2103/12 (2018.08); H01L 2224/2912 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29117 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/29169 (2013.01); H01L 2224/29173 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/35121 (2013.01); H05K 3/3463 (2013.01); H05K 2201/10166 (2013.01);
Abstract

The present invention suppresses fracture at an interface between different materials, and provides a solder joining which includes: a solder joining layerhaving a melted solder material, containing Sb at more than 5.0% by mass and 10.0% by mass or less, Ag at 2.0 to 4.0% by mass, Ni at more than 0 and 1.0% by mass or less, and a balance made up of Sn and inevitable impurities; and joining membersandat least one of which is a Cu or Cu-alloy member, in which the solder joining layer includes a first structurecontaining (Cu, Ni)(Sn, Sb)and a second structurecontaining (Ni, Cu)(Sn, Sb)(in the formula, X is 1, 2, or 4) at an interface with the Cu or Cu-alloy member, and an electronic device and a semiconductor device including the solder joining.

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