The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Oct. 21, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A plurality of semiconductor devices (--) are provided on an upper surface of the conductive base plate () via an insulating substrate () and a conductive pattern (-). A plurality of fins () are provided on a lower surface of the conductive base plate (). A heat dissipating base plate () is provided to tips of the plurality of fins (). A cooler () having an inflow port () and an outflow port () in a bottom surface surrounds the plurality of fins () and the heat dissipating base plate (). A partition () separates a space surrounded by the cooler () and the heat dissipating base plate () into an inflow-side space () connected to the inflow port () and an outflow-side space () connected to the outflow port (). A first slit () is provided in a central portion of the heat dissipating base plate (). Second and third slits () are respectively provided on both sides of the heat dissipating base plate () along a direction from an inflow side to an outflow side. One of the first slit () and the second and third slits () is an inflow-side slit connected to the inflow-side space () and the other is an outflow-side slit connected to the outflow-side space ().