The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Sep. 30, 2016
Astec International Limited, Kwun Tong, HK;
Rahul Vinaykumar Davare, Eden Prairie, MN (US);
Robert Henry Kippley, Eagan, MN (US);
Kwong Kei Chin, Fremont, CA (US);
Astec International Limited, Kwun Tong, Kowloon, HK;
Abstract
According to some aspects of the present disclosure, heat sink assemblies are disclosed. Example heat sink assemblies include a printed circuit board having a first side and a second side. The printed circuit board defines an opening extending from the first side to the second side. The heat sink assembly also includes a heat sink coupled to the first side of the printed circuit board. The heat sink includes a protrusion extending through the through opening of the printed circuit board. The heat sink assembly further includes a surface mounted device coupled to the second side of the printed circuit board. The surface mounted device is in thermal contact with the protrusion of the heat sink to transfer heat from the surface mounted device to the heat sink. Example methods of manufacturing heat sink assemblies are also disclosed.