The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Jul. 27, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Fumihito Kawahara, Tokyo, JP;

Koji Yamada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 23/053 (2013.01);
Abstract

A semiconductor module includes a case. The case includes a bottom part, a case frame, and a case lid. An inner electrode and a stud bolt are provided inside the case. A head part of the stud bolt is tapered, and a tubular part has an inner diameter that increases downward so as to keep a constant distance from the sides of the head part. With this structure, even if the stud bolt is pulled up, the tubular part can hold down the head part. Therefore, the stud bolt can be prevented from being loosened or detached by the force applied from a terminal fixing screw when an external connection terminal is attached or removed.


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