The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Jul. 19, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Jin-Yeol Yang, Cheonan-si, KR;
Hyung-Su Son, Hwaseong-si, KR;
Hae-Gu Lee, Asan-si, KR;
Dong-Su Han, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/66 (2006.01); B23K 26/359 (2014.01); G01N 23/20 (2018.01); B23K 103/00 (2006.01); H01L 21/263 (2006.01); H01L 21/683 (2006.01); B23K 101/40 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); B23K 26/359 (2015.10); G01N 23/20 (2013.01); H01L 21/78 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); H01L 21/2633 (2013.01); H01L 21/304 (2013.01); H01L 21/6836 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.