The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Sep. 15, 2015
Applicant:
Center for Integrated Smart Sensors Foundation, Daejeon, KR;
Inventors:
Assignee:
CENTER FOR INTEGRATED SMART SENSORS FOUNDATION, Daejeon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/047 (2006.01); H01L 23/15 (2006.01); H01L 23/057 (2006.01); H01L 23/08 (2006.01); H03F 3/21 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/481 (2013.01); H01L 21/4807 (2013.01); H01L 23/047 (2013.01); H01L 23/057 (2013.01); H01L 23/08 (2013.01); H03F 3/21 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 3/103 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01);
Abstract
Disclosed is a method of packaging a power amplifier module. The method of packaging a power amplifier module includes providing a unified pattern including a ceramic layer and a pattern formed on the ceramic layer, bonding the unified pattern on a metal layer, and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer.