The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Sep. 05, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jiarui Wang, Santa Clara, CA (US);

Prashant Kumar Kulshreshtha, San Jose, CA (US);

Eswaranand Venkatasubramanian, Santa Clara, CA (US);

Susmit Singha Roy, Mountain View, CA (US);

Kwangduk Douglas Lee, Redwood City, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/033 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/50 (2006.01); H01L 21/02 (2006.01); H01L 27/11556 (2017.01); H01L 27/11582 (2017.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0332 (2013.01); C23C 16/342 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/50 (2013.01); H01L 21/0217 (2013.01); H01L 21/02112 (2013.01); H01L 21/02164 (2013.01); H01L 21/02205 (2013.01); H01L 21/02274 (2013.01); H01L 21/0337 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); H01L 21/6831 (2013.01);
Abstract

Implementations of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein provide techniques for deposition of thick hardmask films on a substrate. In one implementation, a method of forming a hardmask layer on a substrate is provided. The method comprises applying a chucking voltage to a substrate positioned on an electrostatic chuck in a processing chamber, forming a seed layer comprising boron on a film stack disposed on a substrate by supplying a seed layer gas mixture in the processing chamber while maintaining the chucking voltage, forming a transition layer comprising boron and tungsten on the seed layer by supplying a transition layer gas mixture in the processing chamber and forming a bulk hardmask layer on the transition layer by supplying a main deposition gas mixture in the processing chamber.


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