The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Apr. 29, 2019
Applicant:

Sumitomo Osaka Cement Co., Ltd., Tokyo, JP;

Inventors:

Kei Katou, Tokyo, JP;

Toshio Kataoka, Tokyo, JP;

Junichiro Ichikawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/01 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
G02F 1/0102 (2013.01); H05K 1/028 (2013.01); H05K 1/0216 (2013.01); H05K 1/119 (2013.01); H05K 1/147 (2013.01); H05K 2201/052 (2013.01);
Abstract

An optical modulator including an optical modulation element mounted inside a housing, in which at least a portion of an electric line is connected to an external circuit board through a flexible printed circuit, and which is disposed on the external circuit board. A recess portion that mounts the flexible printed circuit is formed on an outer bottom surface of the housing and at a part where the flexible printed circuit is connected, and a device for preventing a resonance mode is provided such that a resonance mode of a microwave and a millimeter wave or a parallel plate mode is prevented from being generated among a surface A of the recess portion facing the flexible printed circuit, an electric wiring part B provided on the flexible printed circuit overlapping the surface A when seen in a plan view, an electric wiring part C provided on the external circuit board overlapping the surface A when seen in a plan view.


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