The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Feb. 18, 2015
Applicant:

Nippon Steel Nisshin Co., Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Atsushi Sugama, Sakai, JP;

Manabu Oku, Sakai, JP;

Yoshiaki Hori, Shunan, JP;

Kazunari Imakawa, Shunan, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 19/00 (2006.01); B23K 1/00 (2006.01); B23K 20/02 (2006.01); F28F 19/06 (2006.01); F28D 9/00 (2006.01); F28F 3/02 (2006.01); B23K 101/14 (2006.01);
U.S. Cl.
CPC ...
F28F 19/00 (2013.01); B23K 1/0012 (2013.01); B23K 20/02 (2013.01); F28D 9/005 (2013.01); F28F 3/025 (2013.01); F28F 19/06 (2013.01); B23K 2101/14 (2018.08); F28F 2275/04 (2013.01); F28F 2275/061 (2013.01);
Abstract

A plate-type heat exchanger may include a housing. The housing may include a plurality of rectangular plate-like components that are box-like components each having the same shape and having a standing wall section along a peripheral edge. One of the box-like components may be layered on another components reversed in the horizontal direction to form a layered structure having an upper layer component and a lower layer component such that an upper portion of a standing wall section of the lower layer component of the layered structure is fit into a lower portion of a standing wall section of the upper layer component of the layered structure. The angle (θ) of the standing wall sections may be θ≤30°, and at least a portion of a contact region between the upper portion and the lower portion may be joined by solid phase diffusion bonding.


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