The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Dec. 05, 2017
Applicant:
Dic Corporation, Tokyo, JP;
Inventors:
Kenichi Fujisaki, Saitama, JP;
Yuko Koseki, Saitama, JP;
Assignee:
DIC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 20/02 (2006.01); B32B 27/22 (2006.01); B32B 27/18 (2006.01); C08K 9/10 (2006.01); C08L 101/00 (2006.01); C09K 5/06 (2006.01); B32B 27/30 (2006.01); B32B 27/14 (2006.01); B32B 27/36 (2006.01); B32B 15/088 (2006.01); B32B 15/20 (2006.01); C08K 5/00 (2006.01); B32B 27/06 (2006.01); B32B 15/09 (2006.01); B32B 15/085 (2006.01); B32B 9/00 (2006.01); B32B 15/082 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); B32B 27/10 (2006.01); B32B 9/04 (2006.01); B32B 27/08 (2006.01); B32B 27/40 (2006.01); B32B 15/08 (2006.01); B32B 5/30 (2006.01); B32B 27/34 (2006.01); B32B 5/18 (2006.01); B32B 15/095 (2006.01); B32B 5/16 (2006.01);
U.S. Cl.
CPC ...
F28D 20/023 (2013.01); B32B 5/16 (2013.01); B32B 5/18 (2013.01); B32B 5/30 (2013.01); B32B 9/007 (2013.01); B32B 9/045 (2013.01); B32B 9/048 (2013.01); B32B 15/08 (2013.01); B32B 15/082 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/095 (2013.01); B32B 15/20 (2013.01); B32B 27/065 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/14 (2013.01); B32B 27/18 (2013.01); B32B 27/22 (2013.01); B32B 27/281 (2013.01); B32B 27/286 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 27/40 (2013.01); C08K 5/0016 (2013.01); C08K 9/10 (2013.01); C08L 101/00 (2013.01); C09K 5/063 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2260/028 (2013.01); B32B 2260/04 (2013.01); B32B 2264/025 (2013.01); B32B 2264/101 (2013.01); B32B 2264/102 (2013.01); B32B 2266/025 (2013.01); B32B 2266/0228 (2013.01); B32B 2266/0278 (2013.01); B32B 2266/0285 (2013.01); B32B 2307/302 (2013.01); B32B 2307/304 (2013.01); B32B 2307/306 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/54 (2013.01); B32B 2307/546 (2013.01); B32B 2307/58 (2013.01); B32B 2307/732 (2013.01); B32B 2419/00 (2013.01); B32B 2457/00 (2013.01); B32B 2457/10 (2013.01); B32B 2509/10 (2013.01); B32B 2605/003 (2013.01); B32B 2605/10 (2013.01); B32B 2605/18 (2013.01); B32B 2607/02 (2013.01); F28D 20/02 (2013.01); F28D 20/021 (2013.01);
Abstract
A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.