The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Jun. 23, 2017
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Jun Hirabayashi, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); F21K 9/238 (2016.01); H05K 1/18 (2006.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
F21K 9/238 (2016.08); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H05K 3/0064 (2013.01); H05K 2201/049 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10106 (2013.01);
Abstract

The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced.


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