The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Aug. 04, 2014
Applicant:
New Way Machine Components, Inc., Aston, PA (US);
Inventor:
Andrew J. Devitt, Media, PA (US);
Assignee:
NEW WAY MACHINE COMPONENTS, INC., Aston, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C03B 35/14 (2006.01); C03C 15/00 (2006.01); C03C 17/00 (2006.01); C03C 23/00 (2006.01); C23C 14/56 (2006.01); C23C 16/44 (2006.01); C23C 16/54 (2006.01); F16C 33/74 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01); F16C 32/06 (2006.01); B05C 13/00 (2006.01); C23C 16/50 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
C23C 16/458 (2013.01); B05C 13/00 (2013.01); C03B 35/147 (2013.01); C03C 15/00 (2013.01); C03C 17/002 (2013.01); C03C 23/0075 (2013.01); C23C 14/562 (2013.01); C23C 16/4409 (2013.01); C23C 16/50 (2013.01); C23C 16/545 (2013.01); F16C 32/0614 (2013.01); F16C 33/748 (2013.01); H01J 37/3277 (2013.01); H01J 37/32834 (2013.01); H01L 21/67028 (2013.01); H01L 21/67034 (2013.01); H01L 21/67051 (2013.01); H01L 21/67739 (2013.01); F16C 2300/62 (2013.01); Y02P 40/57 (2015.11);
Abstract
A method and apparatus for coating and baking and deposition of surfaces on glass substrate or flexible substrate, such as films and thin glass sheets or other similar work pieces as it transitions thru and between small gaps of aero-static or hydro-static porous media bearings and differentially pumped vacuum grooves, in a non-contact manner, in order to process within a vacuum environment. The process is also intended to incorporate simultaneous and immediately sequential ordering of various processes.