The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Nov. 30, 2016
Applicants:

Shanghai Tianyang Hot Melt Adhesive Co., Ltd, Shanghai, CN;

Kunshan Tianyang Hot Melt Adhesive Co., Ltd., Jiangsu, CN;

Inventors:

Heji Lei, Shanghai, CN;

Zhelong Li, Jiangsu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 167/02 (2006.01); C08K 5/13 (2006.01); C09J 11/06 (2006.01); C08G 63/183 (2006.01); C08G 63/52 (2006.01); C08G 63/85 (2006.01);
U.S. Cl.
CPC ...
C09J 167/02 (2013.01); C08K 5/13 (2013.01); C09J 11/06 (2013.01); C08G 63/183 (2013.01); C08G 63/52 (2013.01); C08G 63/85 (2013.01);
Abstract

A novel copolyester hot-melt adhesive and a preparation method thereof are disclosed. The preparation method mainly includes the following steps: selecting raw materials according to preset ratios, wherein the raw materials include: bisphenol A, maleic acid, terephthalic acid, another dibasic acid, 1,4-butanediol, another dibasic alcohol, catalysts and a stabilizer; producing a prepolymer under negative pressure in a low-temperature section, completing an esterification process under normal pressure in the low-temperature section, and completing a polycondensation step under negative pressure in a high-temperature section, thereby finally preparing the novel copolyester hot-melt adhesive product. According to the disclosed copolyester hot-melt adhesive product, on the basis of maintaining the comprehensive performance of the existing conventional copolyester hot-melt adhesive products, the dry cleaning resistance is greatly enhanced, and is no less than the washing resistance of a polyamide hot-melt adhesive, but the overall cost is lower than that of the conventional polyamide hot-melt adhesives.


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