The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Aug. 06, 2012
Applicants:

Ronnie Halfar, Hamburg, DE;

Sascha Toedter-koenig, Hamburg, DE;

Klaus-w. Lienert, Hamburg, DE;

Simon Rost, Buechen, DE;

Stefan Hartkopp, Hamburg, DE;

Hans-ulrich Moritz, Bendestorf, DE;

Inventors:

Ronnie Halfar, Hamburg, DE;

Sascha Toedter-Koenig, Hamburg, DE;

Klaus-W. Lienert, Hamburg, DE;

Simon Rost, Buechen, DE;

Stefan Hartkopp, Hamburg, DE;

Hans-Ulrich Moritz, Bendestorf, DE;

Assignee:

ELANTAS GmbH, Wesel, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 179/08 (2006.01); C08G 73/16 (2006.01); H01B 13/06 (2006.01); H01B 13/14 (2006.01); H01B 3/30 (2006.01);
U.S. Cl.
CPC ...
C09D 179/085 (2013.01); C08G 73/16 (2013.01); C09D 179/08 (2013.01); H01B 3/306 (2013.01); H01B 13/065 (2013.01); H01B 13/148 (2013.01); H01B 3/308 (2013.01);
Abstract

The present invention relates to a solvent-free wire enamel composition containing extrudable, polyesterimide-containing binders, prepared from polyols, polycarboxylic acids, imide-forming components, and structural elements which are crosslinkable after extrusion.


Find Patent Forward Citations

Halfar, Ronnie. (2019). Solvent-free wire enamel composition (U.S. Patent No. 10501656). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10501656

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…