The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Mar. 15, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Honami Nishino, Osaka, JP;

Hirohisa Hino, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); H05K 7/20 (2006.01); C08K 3/22 (2006.01); C08K 3/14 (2006.01); C08K 3/36 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08K 3/14 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); H05K 7/2039 (2013.01); C08K 2003/2217 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/003 (2013.01); C08K 2201/006 (2013.01); C08L 2203/20 (2013.01); H05K 1/03 (2013.01);
Abstract

A resin composition having excellent heat dissipation can be used in an electronic component and an electronic device. The resin composition includes a silicone resin, an inorganic filler, and an inorganic pigment particle. The inorganic filler includes a first filler having thermal emissivity, and a second filler having thermal conductivity. The second filler is contained in a volume ratio of 2.5 or more and 4.0 or less with respect to the first filler. The inorganic filler is contained in a proportion of 46.8 volume % or more and 76.3 volume % or less with respect to the combined volume of the silicone resin, the inorganic filler, and the inorganic pigment particle.


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