The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Jun. 22, 2016
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Eerik J. Helmick, Seattle, WA (US);

Bradley J. Mitchell, Snohomish, WA (US);

Nick S. Evans, Lynnwood, WA (US);

Damien O. Martin, Lynnwood, WA (US);

Aphea Ann Thornton, Issaquah, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); B65H 59/10 (2006.01); B65H 51/005 (2006.01); H01R 43/048 (2006.01); H01R 43/28 (2006.01); H02G 1/12 (2006.01); H01R 43/052 (2006.01); H01R 43/20 (2006.01); H02G 1/06 (2006.01); H02G 3/04 (2006.01);
U.S. Cl.
CPC ...
B65H 59/10 (2013.01); B65H 51/005 (2013.01); H01R 43/048 (2013.01); H01R 43/28 (2013.01); H02G 1/1256 (2013.01); B65H 2701/36 (2013.01); H01R 43/052 (2013.01); H01R 43/20 (2013.01); H02G 1/06 (2013.01); H02G 3/0437 (2013.01);
Abstract

A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.


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