The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Mar. 12, 2018
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Gary G. Lutnesky, Corvallis, OR (US);
Silam J. Choy, Corvallis, OR (US);
Assignee:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/155 (2006.01); B41J 2/165 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1433 (2013.01); B41J 2/155 (2013.01); B41J 2/162 (2013.01); B41J 2/1623 (2013.01); B41J 2/1637 (2013.01); B41J 2/16535 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/11 (2013.01); B41J 2202/19 (2013.01); B41J 2202/20 (2013.01);
Abstract
In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.