The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Jul. 05, 2017
Applicants:

Intops Co., Ltd., Anyang-si, KR;

Sambu Fine Chemical Co., Ltd., Gimhae-si, KR;

Keunha Kim, Seoul, KR;

Hee-dae Park, Busan, KR;

Inventors:

Keunha Kim, Seoul, KR;

Jung Ah Choi, Siheung-si, KR;

Sung Hoon Kim, Gunpo-si, KR;

Hee-dae Park, Busan, KR;

Assignees:

INTOPS CO., LTD., Anyang-si, KR;

SAMBU FINE CHEMICAL CO., LTD., Gimhae-si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 21/10 (2006.01); B32B 5/02 (2006.01); B32B 7/12 (2006.01); B32B 21/14 (2006.01); B29C 45/16 (2006.01); B29C 45/72 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
B32B 21/10 (2013.01); B29C 45/16 (2013.01); B29C 45/72 (2013.01); B32B 5/022 (2013.01); B32B 7/12 (2013.01); B32B 21/14 (2013.01); B29L 2007/00 (2013.01); B32B 2317/16 (2013.01);
Abstract

Disclosed herein are a real wood film and a method of manufacturing an injection-molded real wood product by using the real wood film. The real wood film includes: a sliced veneer; a non-woven fabric adhered to the bottom surface of the sliced veneer by means of a non-aqueous adhesive, and configured to protect the sliced veneer from moisture; a formation improvement layer adhered to the bottom surface of the non-woven fabric, and configured to prevent the sliced veneer from being wrinkled due to heat applied to the sliced veneer and prevent a crack from occurring; and a thermoplastic adhesive layer adhered to the bottom surface of the formation improvement layer, and configured to enable adhesion to injected resin.


Find Patent Forward Citations

Loading…