The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Nov. 11, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Beijing Boe Display Technology Co., Ltd., Beijing, CN;

Inventors:

Jianguo Xing, Beijing, CN;

Hetao Wang, Beijing, CN;

Bin Yan, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); H01L 21/78 (2006.01); H01L 21/762 (2006.01); B32B 37/12 (2006.01); B32B 38/10 (2006.01); H01L 51/00 (2006.01); B32B 37/14 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); H01L 21/762 (2013.01); H01L 21/78 (2013.01); B32B 2037/148 (2013.01); B32B 2307/204 (2013.01); B32B 2457/20 (2013.01); H01L 51/003 (2013.01); H01L 51/0097 (2013.01);
Abstract

A substrate structure and methods for method for attaching a flexible substrate and for peeling off a flexible substrate are disclosed. The substrate structure includes a carrier substrate and a flexible substrate disposed on the carrier substrate, the substrate structure further including a bonding layer interposed between the carrier substrate and the flexible substrate, or more than one bonding layers parallel interposed between the carrier substrate and the flexible substrate, wherein the bonding layer includes an electroviscosity layer, viscous strength of which changes under effect of electric field, the electroviscosity layer is disposed on a contact surface between the bonding layer and the flexible substrate.


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