The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Mar. 01, 2011
Applicant:
Steven D. Oliver, San Jose, CA (US);
Inventor:
Steven D. Oliver, San Jose, CA (US);
Assignee:
SO-SEMI TECHNOLOGIES, LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 33/00 (2010.01); H01L 21/98 (2006.01); H01L 21/02 (2006.01); H01L 25/075 (2006.01); H01L 21/56 (2006.01); B29C 43/18 (2006.01); H01L 23/00 (2006.01); B29C 33/42 (2006.01); B29L 31/00 (2006.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
B29C 43/18 (2013.01); H01L 24/97 (2013.01); B29C 33/424 (2013.01); B29C 2043/181 (2013.01); B29L 2031/747 (2013.01); H01L 33/486 (2013.01); H01L 33/58 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01087 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/005 (2013.01);
Abstract
Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses.