The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2019
Filed:
Apr. 15, 2016
Applicant:
Ce Pharm Co., Ltd, Taizhou, CN;
Inventors:
Dawei Ma, Shanghai, CN;
Wei Zhou, Shanghai, CN;
Mengyang Fan, Shanghai, CN;
Haibo Wu, Shanghai, CN;
Junli Yin, Shanghai, CN;
Shanghua Xia, Shanghai, CN;
Assignee:
CE Pharm CO., LTD, Taizhou, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07D 207/325 (2006.01); B01J 31/22 (2006.01); C07C 231/02 (2006.01); C07C 233/56 (2006.01); C07B 41/02 (2006.01); C07B 43/04 (2006.01); C07B 45/06 (2006.01); C07C 41/26 (2006.01); C07C 45/64 (2006.01); C07C 209/08 (2006.01); C07C 209/10 (2006.01); C07C 213/02 (2006.01); C07C 213/08 (2006.01); C07C 221/00 (2006.01); C07C 231/12 (2006.01); C07C 231/14 (2006.01); C07C 253/30 (2006.01); C07C 315/04 (2006.01); C07C 319/14 (2006.01); C07C 319/20 (2006.01); C07D 207/06 (2006.01); C07D 207/14 (2006.01); C07D 207/335 (2006.01); C07D 209/86 (2006.01); C07D 213/40 (2006.01); C07D 213/65 (2006.01); C07D 213/73 (2006.01); C07D 213/89 (2006.01); C07D 215/20 (2006.01); C07D 215/38 (2006.01); C07D 215/40 (2006.01); C07D 217/22 (2006.01); C07D 231/12 (2006.01); C07D 233/60 (2006.01); C07D 239/42 (2006.01); C07D 241/18 (2006.01); C07D 241/20 (2006.01); C07D 241/42 (2006.01); C07D 263/56 (2006.01); C07D 277/64 (2006.01); C07D 277/66 (2006.01); C07D 295/00 (2006.01); C07D 295/096 (2006.01); C07D 295/135 (2006.01); C07D 307/22 (2006.01); C07D 307/52 (2006.01); C07D 307/81 (2006.01); C07D 317/28 (2006.01); C07D 317/58 (2006.01); C07D 317/64 (2006.01); C07D 317/66 (2006.01); C07D 333/20 (2006.01); C07D 335/16 (2006.01); C07D 471/04 (2006.01); C07D 495/04 (2006.01); C07D 333/58 (2006.01); C07D 213/74 (2006.01); C07D 223/12 (2006.01); C07D 223/22 (2006.01); C07D 333/36 (2006.01); C07D 333/54 (2006.01); C07D 239/545 (2006.01); C07D 207/27 (2006.01); C07D 209/08 (2006.01); C07D 211/72 (2006.01);
U.S. Cl.
CPC ...
B01J 31/2243 (2013.01); B01J 31/22 (2013.01); C07B 41/02 (2013.01); C07B 43/04 (2013.01); C07B 45/06 (2013.01); C07C 41/26 (2013.01); C07C 45/64 (2013.01); C07C 209/08 (2013.01); C07C 209/10 (2013.01); C07C 213/02 (2013.01); C07C 213/08 (2013.01); C07C 221/00 (2013.01); C07C 231/02 (2013.01); C07C 231/12 (2013.01); C07C 231/14 (2013.01); C07C 233/56 (2013.01); C07C 253/30 (2013.01); C07C 315/04 (2013.01); C07C 319/14 (2013.01); C07C 319/20 (2013.01); C07D 207/06 (2013.01); C07D 207/14 (2013.01); C07D 207/27 (2013.01); C07D 207/325 (2013.01); C07D 207/335 (2013.01); C07D 209/08 (2013.01); C07D 209/86 (2013.01); C07D 211/72 (2013.01); C07D 213/40 (2013.01); C07D 213/65 (2013.01); C07D 213/73 (2013.01); C07D 213/74 (2013.01); C07D 213/89 (2013.01); C07D 215/20 (2013.01); C07D 215/38 (2013.01); C07D 215/40 (2013.01); C07D 217/22 (2013.01); C07D 223/12 (2013.01); C07D 223/22 (2013.01); C07D 231/12 (2013.01); C07D 233/60 (2013.01); C07D 239/42 (2013.01); C07D 239/545 (2013.01); C07D 241/18 (2013.01); C07D 241/20 (2013.01); C07D 241/42 (2013.01); C07D 263/56 (2013.01); C07D 277/64 (2013.01); C07D 277/66 (2013.01); C07D 295/00 (2013.01); C07D 295/096 (2013.01); C07D 295/135 (2013.01); C07D 307/22 (2013.01); C07D 307/52 (2013.01); C07D 307/81 (2013.01); C07D 317/28 (2013.01); C07D 317/58 (2013.01); C07D 317/64 (2013.01); C07D 317/66 (2013.01); C07D 333/20 (2013.01); C07D 333/36 (2013.01); C07D 333/54 (2013.01); C07D 333/58 (2013.01); C07D 335/16 (2013.01); C07D 471/04 (2013.01); C07D 495/04 (2013.01); B01J 2231/4283 (2013.01); B01J 2231/4288 (2013.01); B01J 2231/4294 (2013.01); B01J 2531/16 (2013.01);
Abstract
The present invention provides oxalic amide ligands and uses thereof in copper-catalyzed coupling reaction of aryl halides. Specifically, the present invention provides a use of a compound represented by formula I, wherein definitions of each group are described in the specification. The compound represented by formula I can be used as a ligand in copper-catalyzed coupling reaction of aryl halides for the formation of C—N, C—O and C—S bonds.