The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Jan. 29, 2015
Applicant:

Lockheed Martin Corporation, Bethesda, MD (US);

Inventors:

Steven Lloyd Sinsabaugh, Abingdon, MD (US);

Peter V. Bedworth, Los Gatos, CA (US);

David Francis Casey, Jr., Voorhees, NJ (US);

Scott E. Heise, San Jose, CA (US);

Steven W. Sinton, Palo Alto, CA (US);

Randall Mark Stoltenberg, Palo Alto, CA (US);

Jacob Louis Swett, Mountain View, CA (US);

Assignee:

Lockheed Martin Corporation, Bethesda, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 67/00 (2006.01); B01D 69/10 (2006.01); B01D 71/02 (2006.01); B01D 69/02 (2006.01);
U.S. Cl.
CPC ...
B01D 67/0069 (2013.01); B01D 67/0053 (2013.01); B01D 67/0058 (2013.01); B01D 69/10 (2013.01); B01D 71/021 (2013.01); B01D 67/002 (2013.01); B01D 67/003 (2013.01); B01D 67/0004 (2013.01); B01D 67/0034 (2013.01); B01D 67/0037 (2013.01); B01D 67/0062 (2013.01); B01D 67/0072 (2013.01); B01D 69/02 (2013.01); B01D 2323/39 (2013.01); B01D 2325/24 (2013.01);
Abstract

It can be difficult to remove atomically thin films, such as graphene, graphene-based material and other two-dimensional materials, from a growth substrate and then to transfer the thin films to a secondary substrate. Tearing and conformality issues can arise during the removal and transfer processes. Processes for forming a composite structure by manipulating a two-dimensional material, such as graphene or graphene-base material, can include: providing a two-dimensional material adhered to a growth substrate; depositing a supporting layer on the two-dimensional material while the two-dimensional material is adhered to the growth substrate; and releasing the two-dimensional material from the growth substrate, the two-dimensional material remaining in contact with the supporting layer following release of the two-dimensional material from the growth substrate.


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