The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2019

Filed:

Apr. 06, 2018
Applicant:

Relief Technologies, Inc., San Francisco, CA (US);

Inventors:

Jonathan Moulton Thomas, San Francisco, CA (US);

Brian James Krieger, San Francisco, CA (US);

Richard Thomas Caligaris, Los Altos, CA (US);

Elizabeth Ann Miracle, San Francisco, CA (US);

Grace Hina Lee, San Francisco, CA (US);

Assignee:

Relief Technologies, Inc., San Francisco, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/38 (2006.01); A61F 7/00 (2006.01); A61F 7/10 (2006.01); H01L 23/367 (2006.01); A61F 7/02 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H01L 35/32 (2006.01); A61B 34/00 (2016.01);
U.S. Cl.
CPC ...
A61F 7/007 (2013.01); A61B 34/25 (2016.02); A61F 7/02 (2013.01); A61F 7/10 (2013.01); H01L 23/3675 (2013.01); H01L 23/3731 (2013.01); H01L 23/38 (2013.01); H01L 23/473 (2013.01); H01L 35/32 (2013.01); A61F 2007/0001 (2013.01); A61F 2007/003 (2013.01); A61F 2007/005 (2013.01); A61F 2007/0027 (2013.01); A61F 2007/0075 (2013.01); A61F 2007/0078 (2013.01); A61F 2007/0086 (2013.01); A61F 2007/0093 (2013.01); A61F 2007/0095 (2013.01); A61F 2007/0225 (2013.01); A61F 2007/0228 (2013.01); A61F 2007/0292 (2013.01); A61F 2007/0295 (2013.01); A61F 2007/108 (2013.01);
Abstract

A cooling device includes a package substrate, a plurality of cooling units, and device electronics. The plurality of cooling units are configured to cool a user's body. Each cooling unit includes a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate. Each of the cooling units is connected to the package substrate. The device electronics are coupled to the cooling units. The device electronics are configured to store a first cooling device profile that includes data indicating an amount of power to deliver to each of the cooling units over a period of time. The device electronics are configured to deliver power to the cooling units according to the first cooling device profile, wirelessly receive a second cooling device profile from an external computing device, and deliver power to the cooling units according to the second cooling device profile.


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