The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Sep. 19, 2014
Applicant:
Fuji Corporation, Chiryu-shi, JP;
Inventor:
Katsushi Ota, Anjo, JP;
Assignee:
FUJI CORPORATION, Chiryu-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 3/34 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); H05K 3/341 (2013.01); H05K 3/3457 (2013.01); H05K 3/3463 (2013.01); H05K 3/3494 (2013.01); H05K 13/04 (2013.01); H05K 13/0495 (2013.01); H05K 13/0882 (2018.08); H05K 3/3468 (2013.01);
Abstract
An electronic component mounting system is disclosed. An elapsed time acquiring section acquires an elapsed time from printing onto circuit board by solder printer. A raising and lowering operation changing section changes raising and lowering operation of component holding tool based on the elapsed time from printing acquired by the elapsed time acquiring section. A mounter mounts an electronic component on the solder printed on circuit board by performing raising and lowering of the component holding tool at the raising and lowering operation changed by the raising and lowering operation changing section.