The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Sep. 05, 2018
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventors:
Masaaki Hanao, Nagaokakyo, JP;
Tsuyoshi Katsube, Nagaokakyo, JP;
Hiromichi Kawakami, Nagaokakyo, JP;
Mitsuyoshi Nishide, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); B32B 27/06 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); B32B 27/06 (2013.01); H05K 3/46 (2013.01); H05K 1/0306 (2013.01); H05K 1/162 (2013.01);
Abstract
A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.