The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Sep. 11, 2018
Applicant:

Molex, Llc, Lisle, IL (US);

Inventor:

You-Xiang Zheng, Pudong, CN;

Assignee:

Molex, LLC, Lisle, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/11 (2006.01); H01R 12/70 (2011.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01); H01R 12/52 (2011.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H01R 12/523 (2013.01); H01R 12/7005 (2013.01); H05K 1/116 (2013.01); H05K 3/363 (2013.01); H05K 3/4015 (2013.01); H05K 2201/10371 (2013.01);
Abstract

An electrical conductive module comprises: a circuit board, which has an upper side and a lower side opposite to each other in an up-down direction, the upper side of the circuit board is provided with a plurality of upper side pads, the lower side of the circuit board is provided with a plurality of lower side pads, the lower side pads and the upper side pads are provided in pairs, the lower side pad and the upper side pad in each pair are electrically connected together via a connecting through hole and printed wires which are provided alongside; the circuit board is provided with a plurality of conducting through holes for interposing the lower side pads and the upper side pads in different pairs; and a plurality of conducting posts, which each have a soldering end and a mating end opposite to each other in the up-down direction, the soldering end is soldered to the upper side pad on the circuit board correspondingly. The present disclosure can simplify structure and reduce production cost.


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