The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Nov. 03, 2017
Applicant:

Flex Ltd.;

Inventors:

J H Berkel, BR Rijssen, NL;

Todd Robinson, San Mateo, CA (US);

Joan K. Vrtis, Mesa, AZ (US);

Assignee:

Flex Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/021 (2013.01); H05K 3/022 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H05K 3/0061 (2013.01); H05K 3/4611 (2013.01); H05K 2201/10416 (2013.01);
Abstract

A metal pallet is integrated within a circuit board using a process similar to a multilayer PCB, which integrates the metal pallet into the circuit board at the same time as the supporting layers are fabricated. The use of B-stage material provides a bonding mechanism for the metal pallet to be embedded within the circuit board, creating a cohesive integrated part. Embedding the pallet during the fabrication process, pre-lamination, generates a more robust construction and connection not impacted by post fabrication process in assembly. After assembly the circuit board with embedded metal pallet can be mounted directly on a heat sink, cool ribbon or other feature required to help remove heat. The planar back side surface provides a more robust mounting of the metal pallet than a post fabricated assembly as used in conventional techniques.


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