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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10499490 B1

PDFFull Text
Date of Patent:
Dec. 03, 2019

Filed:

Feb. 07, 2018

High speed differential trace with reduced radiation in return path

Applicant:

Quanta Computer Inc., Taoyuan, TW;

Inventor:

Cheng-Hsien Lee, Taoyuan, TW;

Assignee:

QUANTA COMPUTER INC., Taoyuan, TW;

Attorneys:

Nixon Peabody LLP

Zhou Lu

Primary Examiner:

Sherman Ng

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01P 3/02 (2006.01); H01L 21/56 (2006.01); H01R 12/52 (2011.01); H01R 12/73 (2011.01); H01R 13/6471 (2011.01);
U.S. Cl.
CPC ...
H05K 1/0228 (2013.01); H01L 21/563 (2013.01); H01P 3/026 (2013.01); H01R 12/523 (2013.01); H01R 12/732 (2013.01); H01R 13/6471 (2013.01); H05K 1/0224 (2013.01); H05K 1/0245 (2013.01);
Abstract

A high speed differential trace structure reducing common mode radiation is disclosed. The differential trace structure includes a first trace and a parallel second trace. A printed circuit board layer has a top surface and an opposite bottom surface. The traces are formed on the top surface. The structure includes a ground plane layer having a top layer in contact with the opposite bottom surface of the circuit board. A first void section is formed in the top layer of the ground plane layer to one side of the first trace. A second void section is formed in the top layer of the ground plane layer to one side of the second trace. The length of the second void section is determined based on a target radiation frequency. A third void section is formed in the ground plane layer that joins the first void section and the second void section.

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Lee, Cheng-Hsien. (2019). High speed differential trace with reduced radiation in return path (U.S. Patent No. 10499490). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10499490

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