The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 03, 2019

Filed:

Aug. 02, 2018
Applicant:

Hosiden Corporation, Yao-shi, Osaka, JP;

Inventors:

Naosuke Fukada, Kuratemachi, JP;

Mayumi Kaneko, Kuratemachi, JP;

Ryuji Awamura, Kuratemachi, JP;

Hidenori Motonaga, Kuratemachi, JP;

Kensuke Nakanishi, Kuratemachi, JP;

Assignee:

HOSIDEN CORPORATION, Yao-Shi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H01R 12/52 (2011.01); H04R 1/04 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H01R 12/523 (2013.01); H04R 1/04 (2013.01); H04R 19/005 (2013.01); H04R 2201/003 (2013.01);
Abstract

A microphone assembly including a main board and a microphone. The microphone includes a capacitor or a MEMS chip, a case accommodating the capacitor or the MEMS chip, and a microphone board electrically connected to the capacitor or the MEMS chip. The microphone board has a larger outer dimension than the case and includes a fixing portion and a connecting portion. The case is fixed onto the fixing portion. The connecting portion is a portion of the microphone board, the portion being located outside the case and electrically and mechanically connected to the main board.


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