The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2019
Filed:
Jun. 29, 2016
Applicant:
Ams Sensors Singapore Pte. Ltd., Singapore, SG;
Inventors:
Sai Mun Chan, Singapore, SG;
Hartmut Rudmann, Jona, CH;
Tae Yong Ahn, Singapore, SG;
Kyu Won Hwang, Singapore, SG;
Assignee:
AMS SENSORS SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 27/146 (2006.01); G02B 7/02 (2006.01); G02B 13/00 (2006.01); G02B 7/04 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H04N 5/232 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2257 (2013.01); G02B 7/021 (2013.01); G02B 7/028 (2013.01); G02B 7/04 (2013.01); G02B 13/0085 (2013.01); H01L 21/561 (2013.01); H01L 21/566 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14636 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/23212 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/8592 (2013.01); H01L 2224/97 (2013.01);
Abstract
Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer-level fabrication methods for making the modules.